Zazueta-Raynaud, A.,
Cordova-Rubio, A.,
Lopez-Delgado, R.,
Pelayo-Ceja, J. E.,
Carrillo-Torres, R. C.,
Sanchez-Zeferino, R.,
Alvarez-Ramos, M. E. &
Ayon, A.,
May 2019,
2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019. Institute of Electrical and Electronics Engineers Inc., 8752671. (2019 Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2019).
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review