Charge trapping dependence on the physical structure of ultra-thin ALD-HfSiON/TiN gate stacks

Siddarth A. Krishnan*, M. A. Quevedo-Lopez, Rino Choi, Paul D. Kirsch, Chadwin Young, Rusty Harris, Jeff J. Peterson, Hong Jyh Li, Byoung Hun Lee, Jack C. Lee

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

Positive bias temperature instability (PBTI) is investigated in ultra-thin higb-κ films as a function of dielectric thickness on two different interfaces: SiO2 and SiON. It is shown that charge trapping-induced threshold voltage (VTH) instability is exponentially dependent on dielectric thickness (or equivalent oxide thickness [EOT]) in the thickness range investigated. We propose that the significantly reduced charge trapping at thicknesses less than 2,0 nm is due to a change in the physical structure from suppressed crystallization at lesser thicknesses, resulting in reduced trap density. It is also observed that the SiON interface shows higher VTH instability than the corresponding SiO2 interface, while thickness dependence is the same for both.

Original languageEnglish
Title of host publication2005 IEEE International Integrated Reliability Workshop Final Report, IIRW 2005
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages89-90
Number of pages2
ISBN (Print)0780389921, 9780780389922
DOIs
StatePublished - 2005
Event2005 IEEE International Integrated Reliability Workshop, IIRW 2005 - S. Lake Tahoe, CA, United States
Duration: 17 Oct 200520 Oct 2005

Publication series

NameIEEE International Integrated Reliability Workshop Final Report
Volume2005
ISSN (Print)1930-8841
ISSN (Electronic)2374-8036

Conference

Conference2005 IEEE International Integrated Reliability Workshop, IIRW 2005
Country/TerritoryUnited States
CityS. Lake Tahoe, CA
Period17/10/0520/10/05

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