Deposition method-induced stress effect on ultrathin titanium nitride etch characteristics

M. M. Hussain, M. A. Quevedo-Lopez, H. N. Alshareef, D. Larison, K. Mathur, B. E. Gnade

Research output: Contribution to journal › Article › peer-review

Original language	American English
Pages (from-to)	361-363
Number of pages	3
Journal	Electrochemical and Solid-State Letters
DOIs	https://doi.org/10.1149/1.2359100
State	Published - 6 Nov 2006
Externally published	Yes

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title = "Deposition method-induced stress effect on ultrathin titanium nitride etch characteristics",

author = "Hussain, {M. M.} and Quevedo-Lopez, {M. A.} and Alshareef, {H. N.} and D. Larison and K. Mathur and Gnade, {B. E.}",

year = "2006",

month = nov,

day = "6",

doi = "10.1149/1.2359100",

language = "American English",

pages = "361--363",

journal = "Electrochemical and Solid-State Letters",

issn = "1099-0062",

publisher = "Electrochemical Society, Inc.",

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TY - JOUR

T1 - Deposition method-induced stress effect on ultrathin titanium nitride etch characteristics

AU - Hussain, M. M.

AU - Quevedo-Lopez, M. A.

AU - Alshareef, H. N.

AU - Larison, D.

AU - Mathur, K.

AU - Gnade, B. E.

PY - 2006/11/6

Y1 - 2006/11/6

U2 - 10.1149/1.2359100

DO - 10.1149/1.2359100

M3 - Article

SP - 361

EP - 363

JO - Electrochemical and Solid-State Letters

JF - Electrochemical and Solid-State Letters

SN - 1099-0062

ER -