Abstract
We investigated the effects of hafnium oxide (HfO2) gate dielectric thickness and forming gas annealing on threshold voltage instability in zinc oxide thin film transistors using a variety of gate voltage - drain current testing methodologies. We found that dielectric thickness reduction and annealing significantly decreased the threshold voltage instability and the Vt reduction remained over an extended period of testing. Then, a similar investigation was conducted on zinc oxide thin-film transistors (ZnO TFT) with a thin layer of aluminum oxide (Al2O3) as the dielectric where a significant reduction in ΔVt was also observed.
Original language | English |
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Title of host publication | 2015 IEEE International Integrated Reliability Workshop |
Subtitle of host publication | Final Report, IIRW 2015 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 34-36 |
Number of pages | 3 |
ISBN (Electronic) | 9781467373968 |
DOIs | |
State | Published - 18 Mar 2016 |
Event | IEEE International Integrated Reliability Workshop: Final Report, IIRW 2015 - S. Lake Tahoe, United States Duration: 11 Oct 2015 → 15 Oct 2015 |
Publication series
Name | IEEE International Integrated Reliability Workshop Final Report |
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Volume | 2016-March |
ISSN (Print) | 1930-8841 |
ISSN (Electronic) | 2374-8036 |
Conference
Conference | IEEE International Integrated Reliability Workshop: Final Report, IIRW 2015 |
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Country/Territory | United States |
City | S. Lake Tahoe |
Period | 11/10/15 → 15/10/15 |
Bibliographical note
Publisher Copyright:© 2015 IEEE.
Keywords
- Al2O3
- HfO2
- TFT
- ZnO
- threshold voltage instability