Hot carrier stress investigation of zinc oxide thin film transistors with an al2o3 gate dielectric

Rodolfo A. Rodriguez-Davila, Israel Mejia, Manuel Quevedo-Lopez, Chadwin D. Young

Research output: Contribution to conference › Paper

Original language	American English
DOIs	https://doi.org/10.1109/IPFA.2018.8452171
State	Published - 30 Aug 2018
Externally published	Yes
Event	Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA - Duration: 30 Aug 2018 → …

Conference	Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
Period	30/08/18 → …

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Rodriguez-Davila, R. A., Mejia, I., Quevedo-Lopez, M., & Young, C. D. (2018). Hot carrier stress investigation of zinc oxide thin film transistors with an al2o3 gate dielectric. Paper presented at Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, . https://doi.org/10.1109/IPFA.2018.8452171

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title = "Hot carrier stress investigation of zinc oxide thin film transistors with an al2o3 gate dielectric",

author = "Rodriguez-Davila, {Rodolfo A.} and Israel Mejia and Manuel Quevedo-Lopez and Young, {Chadwin D.}",

year = "2018",

month = aug,

day = "30",

doi = "10.1109/IPFA.2018.8452171",

language = "American English",

note = "Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA ; Conference date: 30-08-2018",

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2018. Paper presented at Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, .

Research output: Contribution to conference › Paper

TY - CONF

T1 - Hot carrier stress investigation of zinc oxide thin film transistors with an al2o3 gate dielectric

AU - Rodriguez-Davila, Rodolfo A.

AU - Mejia, Israel

AU - Quevedo-Lopez, Manuel

AU - Young, Chadwin D.

PY - 2018/8/30

Y1 - 2018/8/30

U2 - 10.1109/IPFA.2018.8452171

DO - 10.1109/IPFA.2018.8452171

M3 - Paper

T2 - Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Y2 - 30 August 2018

ER -