Resumen
We investigated the effects of hafnium oxide (HfO2) gate dielectric thickness and forming gas annealing on threshold voltage instability in zinc oxide thin film transistors using a variety of gate voltage - drain current testing methodologies. We found that dielectric thickness reduction and annealing significantly decreased the threshold voltage instability and the Vt reduction remained over an extended period of testing. Then, a similar investigation was conducted on zinc oxide thin-film transistors (ZnO TFT) with a thin layer of aluminum oxide (Al2O3) as the dielectric where a significant reduction in ΔVt was also observed.
Idioma original | Inglés |
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Título de la publicación alojada | 2015 IEEE International Integrated Reliability Workshop |
Subtítulo de la publicación alojada | Final Report, IIRW 2015 |
Editorial | Institute of Electrical and Electronics Engineers Inc. |
Páginas | 34-36 |
Número de páginas | 3 |
ISBN (versión digital) | 9781467373968 |
DOI | |
Estado | Publicada - 18 mar. 2016 |
Evento | IEEE International Integrated Reliability Workshop: Final Report, IIRW 2015 - S. Lake Tahoe, Estados Unidos Duración: 11 oct. 2015 → 15 oct. 2015 |
Serie de la publicación
Nombre | IEEE International Integrated Reliability Workshop Final Report |
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Volumen | 2016-March |
ISSN (versión impresa) | 1930-8841 |
ISSN (versión digital) | 2374-8036 |
Conferencia
Conferencia | IEEE International Integrated Reliability Workshop: Final Report, IIRW 2015 |
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País/Territorio | Estados Unidos |
Ciudad | S. Lake Tahoe |
Período | 11/10/15 → 15/10/15 |
Nota bibliográfica
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