TY - GEN
T1 - High performing pMOSFETs on Si(110) for application to hybrid orientation technologies - Comparison of HfO2 and HfSiON
AU - Krishnan, Siddarth A.
AU - Harris, H. Rusty
AU - Kirsch, Paul D.
AU - Krug, Cristiano
AU - Quevedo-Lopez, Manuel
AU - Young, Chadwin
AU - Lee, Byoung Hun
AU - Choi, Rino
AU - Chowdhury, Naser
AU - Suthram, Sagar
AU - Thompson, Scott
AU - Bersuker, Gennadi
AU - Jammy, Rajarao
PY - 2006
Y1 - 2006
N2 - A comprehensive study implementing a high-k/metal gate stack on Si(110) substrates has been performed, including a comparison of HfO2 and HfSiON, and compatibility with strain engineering. We demonstrate p-channel MOSFETs (pFETs) with optimized Atomic Layer Deposited (ALD) HfO2 on Si(100) substrates with a ∼ 3.3× high field hole mobility (μh) enhancement vs. a Si(100) substrate. On-state drain current (Ion) obtained for the HfO2/Si(110) is -831 μA/um at 100 nA/μm offstate drain current (Ioff). This is among the best performing pFETs ever reported. We also report, for the first time, a difference in performance between HfO2 and HfSiON on Si(110). HfO2 exhibits better hole mobility and overall performance than HfSiON on Si(110). Low temperature hole mobility measurements suggest that HfO2 has reduced coulomb and surface roughness scattering vs. HfSiON.
AB - A comprehensive study implementing a high-k/metal gate stack on Si(110) substrates has been performed, including a comparison of HfO2 and HfSiON, and compatibility with strain engineering. We demonstrate p-channel MOSFETs (pFETs) with optimized Atomic Layer Deposited (ALD) HfO2 on Si(100) substrates with a ∼ 3.3× high field hole mobility (μh) enhancement vs. a Si(100) substrate. On-state drain current (Ion) obtained for the HfO2/Si(110) is -831 μA/um at 100 nA/μm offstate drain current (Ioff). This is among the best performing pFETs ever reported. We also report, for the first time, a difference in performance between HfO2 and HfSiON on Si(110). HfO2 exhibits better hole mobility and overall performance than HfSiON on Si(110). Low temperature hole mobility measurements suggest that HfO2 has reduced coulomb and surface roughness scattering vs. HfSiON.
UR - http://www.scopus.com/inward/record.url?scp=46049086797&partnerID=8YFLogxK
U2 - 10.1109/IEDM.2006.346758
DO - 10.1109/IEDM.2006.346758
M3 - Contribución a la conferencia
AN - SCOPUS:46049086797
SN - 1424404398
SN - 9781424404391
T3 - Technical Digest - International Electron Devices Meeting, IEDM
BT - 2006 International Electron Devices Meeting Technical Digest, IEDM
T2 - 2006 International Electron Devices Meeting, IEDM
Y2 - 10 December 2006 through 13 December 2006
ER -