Higher permittivity rare earth-doped HfO2 and ZrO2 dielectrics for logic and memory applications

S. Govindarajan*, T. S. Böscke, P. D. Kirsch, M. A. Quevedo-Lopez, P. Sivasubramani, S. C. Song, R. W. Wallace, B. E. Gnade, P. Y. Hung, Jimmy Price, U. Schröder, S. Ramanathan, B. H. Lee, R. Jammy

*Autor correspondiente de este trabajo

Producción científica: Capítulo del libro/informe/acta de congresoContribución a la conferenciarevisión exhaustiva

3 Citas (Scopus)

Resumen

We demonstrate electrical properties of rare earth (RE)-doped HfO 2 and ZrO2 for application as higher permittivity (k) dielectrics in logic and memory devices. X-ray diffraction (XRD) results show that Dy, Er, and Gd doping stabilizes the higher-k tetragonal phase rather than the lower-k monoclinic phase. This preferred tetragonal phase results in a k-30. Initial electrical results show ∼3nm higher-k enables an equivalent oxide thickness (EOT) of 0.93nm. Alternatively, ∼7nm higher-k reduces leakage currents 1000x relative to HfO2 achieving <10-8 A/cm2 at an EOT of 2nm. Capacitance-voltage (C-V) data show increasing amounts of RE dopants shift flatband voltage (Vfb) in the negative direction vs. pure HfO2.

Idioma originalInglés
Título de la publicación alojada2007 International Symposium on VLSI Technology, Systems and Applications, VLSI-TSA - Proceedings of Technical Papers
DOI
EstadoPublicada - 2007
Evento2007 International Symposium on VLSI Technology, Systems and Applications, VLSI-TSA - Hsinchu, Taiwán
Duración: 23 abr. 200725 abr. 2007

Serie de la publicación

NombreInternational Symposium on VLSI Technology, Systems, and Applications, Proceedings

Conferencia

Conferencia2007 International Symposium on VLSI Technology, Systems and Applications, VLSI-TSA
País/TerritorioTaiwán
CiudadHsinchu
Período23/04/0725/04/07

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