Identification of logic paths influenced by severe coupling capacitances

I. D. Meza-Ibarra, V. Champac, R. Gomez-Fuentes, J. R. Noriega, A. Vera-Marquina

Producción científica: Capítulo del libro/informe/acta de congresoContribución a la conferenciarevisión exhaustiva

Resumen

Modern integrated circuits present complex interconnect structures, in which the signal coupling play an important role in the overall circuit behavior. In this paper, a method to identify those logic paths more significantly influenced by signals at coupled lines is presented. This method can be used to validate circuit behavior and can also be applied in testing techniques oriented to detect interconnect defects (e.g. opens and short defects). A modified Dijkstra's algorithm is used to find those paths between a primary input and a primary output with higher coupling capacitances. This methodology is applied to ISCAS'85 benchmark circuits.

Idioma originalInglés
Título de la publicación alojadaLATS 2019 - 20th IEEE Latin American Test Symposium
EditorialInstitute of Electrical and Electronics Engineers Inc.
ISBN (versión digital)9781728117560
DOI
EstadoPublicada - 1 may. 2019
Evento20th IEEE Latin American Test Symposium, LATS 2019 - Santiago, Chile
Duración: 11 mar. 201913 mar. 2019

Serie de la publicación

NombreLATS 2019 - 20th IEEE Latin American Test Symposium

Conferencia

Conferencia20th IEEE Latin American Test Symposium, LATS 2019
País/TerritorioChile
CiudadSantiago
Período11/03/1913/03/19

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© 2019 IEEE.

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