TY - GEN
T1 - Novel materials and integration schemes for CMOS-based circuits for flexible electronics
AU - Quevedo-Lopez, M. A.
AU - Gowrisanker, S.
AU - Allee, D. R.
AU - Venugopal, S.
AU - Krishna, R.
AU - Kaftanoglu, K.
AU - Alshareef, H. N.
AU - Gnade, B. E.
PY - 2009
Y1 - 2009
N2 - The development of low temperature, thin film transistor processes that has enabled flexible displays also presents opportunities for flexible electronics and flexible integrated systems. Of particular interest are possible applications in flexible, low metal content, sensor systems for unattended ground sensors, smart medical bandages, electronic ID tags for geo-location, conformal antennas, neutron/gamma-ray/x-ray detectors, etc. In this paper, we review the state-of-the-art in flexible electronics materials and devices and present recent results in our efforts to fully integrate complementary metal oxide semiconductors. We conclude with a discussion of the constraints of thin film transistors and the remaining challenges.
AB - The development of low temperature, thin film transistor processes that has enabled flexible displays also presents opportunities for flexible electronics and flexible integrated systems. Of particular interest are possible applications in flexible, low metal content, sensor systems for unattended ground sensors, smart medical bandages, electronic ID tags for geo-location, conformal antennas, neutron/gamma-ray/x-ray detectors, etc. In this paper, we review the state-of-the-art in flexible electronics materials and devices and present recent results in our efforts to fully integrate complementary metal oxide semiconductors. We conclude with a discussion of the constraints of thin film transistors and the remaining challenges.
UR - http://www.scopus.com/inward/record.url?scp=74349097098&partnerID=8YFLogxK
U2 - 10.1149/1.3203989
DO - 10.1149/1.3203989
M3 - Contribución a la conferencia
AN - SCOPUS:74349097098
SN - 9781566777445
T3 - ECS Transactions
SP - 503
EP - 511
BT - ECS Transactions - ULSI Process Integration 6
PB - Electrochemical Society Inc.
T2 - ULSI Process Integration 6 - 216th Meeting of the Electrochemical Society
Y2 - 4 October 2009 through 9 October 2009
ER -