ZnS quantum dots coated with PVP to enhance solar cell performance

J. C. Melendres-Sanchez, Rosendo Lopez-Delgado, A. Ayon, Gerardo Saavedra Rodriguez, R. C.Carrillo Torres Raul Sanchez Zeferino, M. E. Alvarez-Ramos

Producción científica: Capítulo del libro/informe/acta de congresoContribución a la conferenciarevisión exhaustiva

1 Cita (Scopus)

Resumen

We report the synthesis of Zinc Sulfide (ZnS) quantum dots (QDs) coated with PolyvinylPyrrolidone (PVP), and their deployment on the window side of commercial solar cells to quantify their influence on power conversion efficiency (PCE). The quantum dots were excited with wavelengths in wavelength range of 280 to 325 nm and exhibited a photo luminescent emission wavelength of around 380 nm. The synthesis of the ZnS quantum dots was performed in a water-based colloidal solution. The PVP concentration was used to control the ultimate size attained which had a range in diameter from 4.9 to 5.9 nm. Subsequently the QDs were dispersed inpolymethyl methacrylatepolymer (PMMA) and the solution was spin cast on the window side of previously characterized solar cells. The observations indicate a promising increment of 6.62 percent in the power conversion efficiency of the devices involved. The discussion comprises both the results obtained to date and prospective pathways to improve the efficiency of photovoltaic devices harnessing the observed Stokes shift of ZnS quantum dots.

Idioma originalInglés
Título de la publicación alojadaSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018
EditoresRomolo Marcelli, Yoshio Mita, Stewart Smith, Francis Pressecq, Pascal Nouet, Frederick Mailly, Peter Schneider
EditorialInstitute of Electrical and Electronics Engineers Inc.
Páginas1-4
Número de páginas4
ISBN (versión digital)9781538661994
DOI
EstadoPublicada - 22 jun. 2018
Evento20th Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2018 - Roma, Italia
Duración: 22 may. 201825 may. 2018

Serie de la publicación

NombreSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018

Conferencia

Conferencia20th Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2018
País/TerritorioItalia
CiudadRoma
Período22/05/1825/05/18

Nota bibliográfica

Publisher Copyright:
© 2018 IEEE.

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